THERMAL MATERIALS

Seal & Design offers a full range of thermal materials from ThermaCool®

ThermaCool® gives you the freedom to push the envelope on your next-generation concepts without worrying about the impact on the manufacturing process. These products are based upon 50 years of tape manufacturing experience, designing thermal interfaces with creative materials and quality constructions to achieve maximum performance. TheThermaCool® product line give maximum thermal performance in a cost-effective form.

Informational Brochures:

Gap Fillers

The ThermaCool family of high-performance thermally conductive gap fillers provides solutions to difficult thermal management problems. The ThermaCool gap filler family includes products in a variety of thicknesses and a range of hardness values to effectively close gaps while providing the thermal transfer needed in demanding electronic applications.

THERMAL INSULATORS

Thermally Conductive Fabrics are fiberglass-reinforced ceramic filled silicone polymer sheets used to provide thermal transfer and electrical isolation where interface gaps are less than 20 mils and high torque application is required.

THERMAL TAPES

All of the adhesives are flame retardant and are formulated for high performance adhesion while still being easily re-workable without damage to sensitive components.

3M THERMAL MATERIALS

In addition to being a Preferred Converter for adhesives, we also have access to and offer 3M’s line of premium thermal & electrically conductive tapes and materials.

ROGERS HEATSORB

HeatSORB proprietary phase change material addresses thermal management issues by capturing heat – allowing a device to remain cooler by delaying temperature ramps.

HeatSORB material increases thermal efficiency and goes above and beyond traditional heat spreaders such as copper, graphite sheets, or heat pipes. HeatSORB material provides benefit to any application in which high heat of fusion and long-term, reliable thermal management are concerns – especially when real estate is limited.