A thermal gap filler is a piece of material that gets into tiny pockets of air between components and casings. They fill the space to allow for optimal heat resistance in a heat-generating component. This enables enhanced performance and in some cases efficiency in the component or the device.
Gap fillers can be used to fill air gaps between components of PC boards and heat sinks, metal enclosures, and chasses as well as other items. They are ideal for applications where gap tolerances are present due to stepped or rough surfaces. Thermal gap filler materials allow designers and engineers to be less concerned with components’ proximity to heat sinks or heat spreaders.
Advantages of Using Thermal Gap Fillers
In addition to good thermal performance. thermal gap fillers will also provide the benefit of using shock absorption. By nature, the thermal gap filler pads are slightly sticky and allow small air gaps to be removed, reducing thermal resistance to an absolute minimum.
Gap filler pads are cleaner to use than thermal paste and easier to remove than thermal adhesive, which is a huge positive.
Here is a list of benefits:
• Good thermal performance.
• Good shock absorption for e.g. mobile applications.
• Excellent compression.
• Precisely cut to size using our in-house automated machines.
• Slightly sticky by nature.
• Cleaner to use than thermal paste.
• Easy to use.
• Cost effective.
• Can be used on larger surfaces.
• Can be supplied with liner on one side for additional support during assembly.
• Available in a wide variety of thermal conductivity, softness and thickness to suit your design.
What We Use
We offer a wide variety of thermal materials, in particular ThermaCool®.
The ThermaCool line up is a family of high performance thermally conductive gap fillers that provide solutions to difficult thermal management problems. These products can be used to fill gaps and enhance thermal performance of the electrical system. ThermaCool gap fillers can accommodate materials of different coefficients of thermal expansion with the compliant interface. The ThermaCool gap filler family includes products in a variety of thicknesses and a range of hardness values to effectively close gaps while providing the thermal transfer needed in demanding electronic applications.